bzt52c2v4s-bzt52c39s zener diode case : molded plastic body terminals : plated leads solderable per mil-std-750, method 2026 polarity : polarity symbols marked on case features mechanical data planar die construction ultra-small surface mount package ideally suited for automated assembly processes 0.9 200 625 -65 to +150 maximum ratings (tamb=25c unless otherwise specified) symbols units v f p d t j ,t stg v mw c/w c limits parameter r q ja forward voltage (note 2) @i f =10ma power dissipation (note1) thermal resistance, junction to ambient air (note1) operating and storage temperature range notes: 1.valid provided that device terminals are kept at ambient temperature. 2.short duration test pulse used in minimize self -heating effect. 3.f=1khz. sod-323 1.35(0.053) 1.15(0.045) 1.00(.040) 0.80(.031) .08(.003) min .177(.007) .089(.003) 0.4(0.016) .25(0.010) 1.26(.050) 1.24(.048) .305(0.012) .295(0.010) 0.1(0.004) min .72(0.028) .69(0.027) 1.80(0.071) 1.60(0.063) 2.75(0.108) 2.30(0.091) 1.80(0.071) 1.60(0.063) 2.75(0.108) 2.30(0.091) dimensions in millimeters and (inches) mdd electronic
bzt52c2v4s bzt52c2v7s bzt52c3v0s bzt52c3v3s bzt52c3v6s bzt52c3v9s bzt52c4v3s bzt52c4v7s BZT52C5V1S bzt52c5v6s bzt52c6v2s bzt52c6v8s bzt52c7v5s bzt52c8v2s bzt52c9v1s bzt52c10s bzt52c11s bzt52c12s bzt52c13s bzt52c15s bzt52c16s bzt52c18s bzt52c20s bzt52c22s bzt52c24s bzt52c27s bzt52c30s bzt52c33s bzt52c36s bzt52c39s wx w1 w2 w3 w4 w5 w6 w7 w8 w9 wa wb wc wd we wf wg wh wi wj wk wl wm wn wo wp wq wr ws wt 2.2 2.5 2.8 3.1 3.4 3.7 4.0 4.4 4.8 5.2 5.8 6.4 7.0 7.7 8.5 9.4 10.4 11.4 12.4 13.8 15.3 16.8 18.8 20.8 22.8 25.1 28.0 31.0 34.0 37.0 type number type code zener voltage range (note 2) nom(v) 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 min(v) max(v) 2.6 2.9 3.2 3.5 3.8 4.1 4.6 5.0 5.4 6.0 6.6 7.2 7.9 8.7 9.6 10.6 11.6 12.7 14.1 15.6 17.1 19.1 21.2 23.3 25.6 28.9 32.0 35.0 38.0 41.0 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 2 2 2 2 2 ma i zr v z @i zr maximum zener impedance (note 3) i zk ma z zr @i zr z zr @i zk 100 100 95 95 90 90 90 80 60 40 10 15 15 15 15 20 20 25 30 30 40 45 55 55 70 80 80 80 90 130 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 0.5 0.5 0.5 0.5 0.5 50 20 10 5 5 3 3 3 2 1 3 2 1 0.7 0.5 0.2 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 maximum reverse current (note 2) temperature coefficent of zener voltage @i zt =5ma mv / c i r v r v ua min max 1.0 1.0 1.0 1.0 1.0 1.0 1.0 2.0 2.0 2.0 4.0 4.0 5.0 5.0 6.0 7.0 8.0 8.0 8.0 10.5 11.2 12.6 14.0 15.4 16.8 18.9 21.0 23.1 25.2 27.3 -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -2.7 -2.0 0.4 1.2 2.5 3.2 3.8 4.5 5.4 6.0 7.0 9.2 10.4 12.4 14.4 16.4 18.4 21.4 24.4 27.4 30.4 33.4 0 0 0 0 0 0 0 0.2 1.2 2.5 3.7 4.5 5.3 6.2 7.0 8.0 9.0 10.0 11.0 13.0 14.0 16.0 18.0 20.0 22.0 25.3 29.4 33.4 37.4 41.2 600 600 600 600 600 600 600 500 480 400 150 80 80 80 100 150 150 150 170 200 200 225 225 250 250 300 300 325 350 350 note: 1.valid prvided device terminals are kept at ambient temperatrue 2.test with pluses, period=5ms,pluse width=300 u s. 3.f=1khz mdd electronic electrical characteristics (@ ta=25 c unless otherwise specified)
ratings and characteristic curves bzt52c2v4s-bzt52c39s 0 1 2 3 4 5 6 7 8 9 10 v z, zener voltage (v) fig. 2-zener breakdown characteristics fig. 1- power derating curve p d , power disspation (mw) i z , zener current (ma) 50 40 30 20 10 0 0 100 200 t a, ambient temperature( c ) 500 400 300 200 100 0 v z , nominal zener voltage(v) fig. 4-junction capacitance vs nominal zener voltage v z , zener current (ma) 30 20 10 0 0 10 20 30 40 fig. 3-zener breakdown characteristics c j , junction capacitance (pf) 0 10 100 1000 100 10 see note1 v z, zener voltage (v) t j =25 v a =1v v a =2v v a =2v v a =1v t j =25 c10 c12 c15 c18 c22 c27 c33 c36 test current i z 2 ma test current i z 5 ma t j =25 c2v7 c3v3 c3v9 c4v7 c5v6 c6v6 c8v2 test current i z 5 ma mdd electronic
ratings and characteristic curves bzt52c2v4s-bzt52c39s package outline plastic surface mounted package sod-323 soldering footprint unit : mm package information device package shipping bzt52c2v0s-bzt52c39s sod-323 3000/tape&reel sod-323 dim min max a 1.275 1.325 b 1.675 1.725 c 0.9 typical d 0.25 0.35 e 0.27 0.37 h 0.02 0.1 j 0.1 typical k 2.6 2.7 all dimensions in mm e k h d c b a j mdd electronic
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